Three major material categories covering wafer manufacturing raw materials, equipment component materials, and wafer handling consumables. Click a category to expand and view key parameters and supply details for sub-categories.
Silicon carbide powder for raw materials in SiC crystal growth and for grinding and polishing, selected based on purity and particle size distribution to match specific applications.
Boron-carbon compound material with high hardness, lightweight properties, and neutron absorption capability for wear-resistant components and functional parts of equipment.
Specialized packaging container for semiconductor wafer outbound logistics, made from low-particle high-purity PP material to ensure optimal yield during unpacking at the client's site.
Wafer carrier for semiconductor silicon wafer cleaning processes. Features a precision design with uniform groove spacing to securely hold wafers, optimized for strict cleanroom environments.
Wax-free adsorption pad and liner for CMP chemical mechanical polishing, securing wafers via water surface tension to replace traditional wax bonding and prevent wax residue contamination.
A transport container for wafer movement between process steps and short-term storage, matched to wafer diameter and automated loading/unloading methods.
Submit variety, specifications, and quantity. We'll source, compare prices, and confirm supply through compliant channels.
